creat by art - glass passivated junction chip - ideal for automated placement - low profile package - low power loss, high efficiency - halogen-free according to iec 61249-2-21 molding compound: ul flammability classification rating 94v-0 moisture sensitivity level: level 1, per j-std-020 packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 1a whisker test symbol ES2DF es2gf es2jf unit v rrm 200 400 600 v v rms 140 280 420 v v dc 200 400 600 v i f(av) a c j pf t rr ns t j c t stg c document number: ds_d0000114 version: a15 note 3: test conditions: i f =0.5a, i r =1.0a, i rr =0.25a taiwan semiconductor 20 75 operating junction temperature range storage temperature range note 1: pulse test with pw=300 s, 1% duty cycle - 55 to +150 - 55 to +150 10 note 2: measured at 1 mhz and applied vr=4.0 v c/w 350 35 i fsm typical junction capacitance (note 2) 10 1.00 1.30 1.70 a maximum instantaneous forward voltage (note 1) @ 2 a v f v maximum reverse recovery time (note 3) typical thermal resistance r jl r ja maximum reverse current @ rated v r t j =25c t j =125c maximum repetitive peak reverse voltage parameter i r a maximum rms voltage maximum dc blocking voltage maximum average forward rectified current peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load 2 50 polarity: indicated by cathode band weight: 0.101g (approximately) maximum ratings and efectrical characteristics (t a =25c unless otherwise noted) ES2DF - es2jf 2a, 200v - 600v surface mount su p er fast rectifiers features - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec mechanicaf data case: smbf smbf
note 2: whole series with green compound document number: ds_d0000114 version: a15 5,000 / 13" paper reel package packing code suffix description green compound ES2DF r4g es2xf (note 1, 2) part no. ES2DF part no. r4 g example example p/n packing code ratings and characteristics curves (t a =25c unless otherwise noted) r4 note 1: "x" defines voltage from 200v (ES2DF) to 600v (es2jf) ES2DF - es2jf taiwan semiconductor ordering information packing code packing code suffix packing g smbf 0 0.5 1 1.5 2 2.5 3 80 90 100 110 120 130 140 150 average forward current (a) lead temperature ( c) fig.1 forward current derating curve resistive or inductive load 0 10 20 30 40 50 60 1 10 100 peak forward surge current (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave 0.01 0.1 1 10 100 1000 0 20406080100 instantaneous reverse current ( a) percent of rated peak reverse voltage (%) fig. 4 typical reverse characteristics t j =25 c t j =125 c 0.1 1 10 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 instantaneous forward current (a) forward voltage (v) fig. 2 typical instantaneous forward characteristics es2jf pulse width=300 s 1% duty cycle
min max min max a 1.90 2.61 0.075 0.103 b 3.50 3.70 0.138 0.146 c 4.20 4.75 0.165 0.187 d 0.90 1.30 0.035 0.051 e 0.18 0.26 0.007 0.010 f g 5.10 5.50 0.201 0.217 p/n = specific device code g = green compound code yw = date code f = factory code document number: ds_d0000114 version: a15 marking diagram smbf dim. unit (mm) unit (inch) ES2DF - es2jf taiwan semiconductor package outline dimensions 1.00 0.039 0 10 20 30 40 50 60 0.1 1 10 100 junction capacitance (pf) reverse voltage (v) fig. 5 typical junction capacitance f=1.0mhz vsig=50mvp-p
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied, to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d0000114 version: a15 ES2DF - es2jf taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,
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